Heller Industries & MULTI COMPONENTS offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates. Bring us your soldering or curing challenge, and our experienced engineers are ready to provide your customized solution.
Leader in Thermal Process Solutions
