Beschreibung
Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers.
Anlagenmerkmale
- Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H]
- Chamber Usable Area (mm): 350[L] x 350[W] x 227[H]
- Max Operating Pressure: 12 Bar (174 psi)
- Max Operating Temperature:200⁰ C (Forced Air Convection)
- 350⁰ C (Conduction Plate Option)
- Manual Loading
- External Chiller Option
Bilder
